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Methodology

Atomic Force Microscopy (AFM)

Biggest risks

Chronology

Fabrication

Goals

Modular design

Phases

Price Comparison

Parts

ADC (Analog to Digital Converter)

Coarse approach

Controller

Enclousure

Math testing

Piezo DAC

Piezo Support

Power Supply

Sample Bias DAC

Sample

Scan Head

TIA (Transimpedance Amplifier)

Tip Standoff

Tip

Vibration isolation

Wireless

Theory

Bandwidth

SNR (Signal to Noise Ratio)

ADRs

ADR 1: Three or four DAC channels

ADR 2: Codec vs discrete ADC and DAC

Appendices

Bootstraping

Reasons for the name LiSPM

Resolution comparison

Steps to create a module

See source files

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